Quality increases customer satisfaction. Today, 3D metrology enables numerous manufacturing companies to monitor and optimize their quality processes. GOM, a company of the ZEISS Group, offers an all-in solution for quality analysis with its software. In addition to the established software solutions GOM Inspect and GOM Correlate, the Braunschweig-based company provides software packages for additional user groups with the launch of two new products: With GOM Volume Inspect as measurement (…)
Topics / Metrology
Metrology
From mechanical subcontracting to advanced metrology: a look back at Marcel Aubert’s 75th anniversary
Texte français [Deutscher Text->https://eurotec-online.com/vom-unte... Marcel Aubert was founded in 1946 to carry out precision mechanical work and manufacture parts. Now in the hands of the third generation, it is present throughout the world thanks to a diversification in its production decided in the fifties. There are many milestones in the life of a company, particularly when it spans three quarters of a century. Here we look back at some of the key dates in the company’s history, (…)
Metrology
FARO Announces Two New Global Sustainability Goals to Advance ESG Efforts
FARO Technologies, Inc. a global leader for 3D measurement, imaging and realization solutions for 3D Metrology, AEC (Architecture, Engineering & Construction), and Public Safety Analytics, today announced two new strategic goals in support of its Environment, Social & Governance (ESG) efforts. The first new goal is to reduce the Company carbon emissions 25% by 2025 through aggressive activities that improve environmental performance. The second new goal is to establish middle and (…)
Metrology
High-frequency Technology Entirely in Glass
To remain competitive in the field of the Internet of Things, even medium-sized industrial and process metrology companies need to increasingly integrate their sensor circuits into ASICs (application-specific integrated circuits). The semiconductor industry is currently meeting this need with lower costs for development cycles and decreasing quantity hurdles. This is not occurring often enough in chip packaging, meaning that ASICs requiring individual packages are at risk of being bogged (…)